電漿熔射遮蔽膠帶
Single/double side PI tape with thermal resistance non-silicone
adhesive. These products are designed for masking gold
finger contacts during the hot air solder leveling (HASL) process
or to protect some specific areas of FPCB during gold plating,
solder reflow or hot pressing process. And it is also excellent for
temporary fixing of FPC on the carrier jig during SMT or cleaning job.
單/雙面PI 遮蔽膠帶, 適用於Reflow/SMT組裝條件或Plasma電漿熔射遮蔽應用
產品優點:
1. 不殘膠
2. 耐熱~260C
3. 膠黏度可客製
4. non-Silicone PSA完全不產生矽酮揮發物
5. 耐化學藥水攻擊
adhesive. These products are designed for masking gold
finger contacts during the hot air solder leveling (HASL) process
or to protect some specific areas of FPCB during gold plating,
solder reflow or hot pressing process. And it is also excellent for
temporary fixing of FPC on the carrier jig during SMT or cleaning job.
單/雙面PI 遮蔽膠帶, 適用於Reflow/SMT組裝條件或Plasma電漿熔射遮蔽應用
產品優點:
1. 不殘膠
2. 耐熱~260C
3. 膠黏度可客製
4. non-Silicone PSA完全不產生矽酮揮發物
5. 耐化學藥水攻擊
